发明名称 PLATING PART MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a plating part manufacturing method enabled by a simple manufacturing process to form a plating film exclusively on a predetermined pattern while suppressing the formation of the plating film other than in a predetermined pattern.SOLUTION: A plating part manufacturing method comprises: a step S1 of applying a catalyst inactivating agent to the surface of a substrate; a step S2 of heating or optically irradiating a portion of the surface of the substrate, to which said catalyst inactivating agent is applied; a step S3 of holding an electroless plating catalyst on the surface of said substrate; and a step S4 of bringing an electroless plating liquid to the surface of said substrate holding said electroless plating catalyst thereby to form an electroless plating film at either the heating part or the optically irradiation part of said surface.SELECTED DRAWING: Figure 1
申请公布号 JP2016029209(A) 申请公布日期 2016.03.03
申请号 JP20150128004 申请日期 2015.06.25
申请人 HITACHI MAXELL LTD 发明人 KITO AKIKO;YUSA ATSUSHI;USUKI NAOKI;YAMAMOTO TOMOHITO;GOTO HIDETO;SUENAGA MASASHI
分类号 C23C18/20;C23C18/16;C23C18/31;H05K3/18 主分类号 C23C18/20
代理机构 代理人
主权项
地址
您可能感兴趣的专利