SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING THE SAME, AND IMAGING APPARATUS

摘要

A solid-state imaging device includes: a semiconductor substrate provided with an effective pixel region including a light receiving section that photoelectrically converts incident light; an interconnection layer that is provided at a plane side opposite to the light receiving plane of the semiconductor substrate; a first groove portion that is provided between adjacent light receiving sections and is formed at a predetermined depth from the light receiving plane side of the semiconductor substrate; and an insulating material that is embedded in at least a part of the first groove portion.

主权项

1. An imaging device, comprising:
a semiconductor substrate having
an effective pixel region including a plurality of photoelectric conversion elements configured to receive light,an optical black region,a first groove portion provided between adjacent photoelectric conversion elements in the effective pixel region, anda second groove portion provided in the optical black region; an insulating material disposed, at least in part, in the first groove portion; and a metallic oxide disposed, at least in part, in the first groove portion.