| 发明名称 |
SEMICONDUCTOR MEMORY DEVICE INCLUDING OUTPUT BUFFER |
| 摘要 |
A semiconductor module includes a module substrate, a line pattern provided to the module substrate, first and second semiconductor chips on the module substrate and coupled to the line pattern, and a termination resister on the module substrate and coupled to the line pattern, the termination resistor being located between the first and second semiconductor chips. |
| 申请公布号 |
US2016064366(A1) |
申请公布日期 |
2016.03.03 |
| 申请号 |
US201514839771 |
申请日期 |
2015.08.28 |
| 申请人 |
Micron Technology, Inc. |
发明人 |
Tsukada Wataru;Honda Masayuki;Fukushima Yoshihisa;Cyr Scott Richard |
| 分类号 |
H01L25/18;G11C5/02;H01L23/522;H01L25/065;H01L23/498 |
主分类号 |
H01L25/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor module comprising:
a module substrate; a line pattern provided to the module substrate; first and second semiconductor chips on the module substrate and coupled to the line pattern; and a termination resister on the module substrate and coupled to the line pattern, the termination resistor being located between the first and second semiconductor chips. |
| 地址 |
Boise ID US |
