发明名称 |
SEMICONDUCTOR STRUCTURE HAVING A SOURCE AND A DRAIN WITH REVERSE FACETS |
摘要 |
A semiconductor structure including a semiconductor wafer. The semiconductor wafer includes a gate structure, a first trench in the semiconductor wafer adjacent to a first side of the gate structure and a second trench adjacent to a second side of the gate structure, the first and second trenches filled with a doped epitaxial silicon to form a source in the filled first trench and a drain in the filled second trench such that each of the source and drain are recessed and have an inverted facet. In a preferred exemplary embodiment, the epitaxial silicon is doped with boron. |
申请公布号 |
US2016064523(A1) |
申请公布日期 |
2016.03.03 |
申请号 |
US201514937029 |
申请日期 |
2015.11.10 |
申请人 |
GLOBALFOUNDRIES INC. |
发明人 |
ADAM Thomas N.;CHENG Kangguo;KHAKIFIROOZ Ali;LI Jinghong;REZNICEK Alexander |
分类号 |
H01L29/66;H01L29/08;H01L21/02 |
主分类号 |
H01L29/66 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming a semiconductor structure comprising:
obtaining a semiconductor wafer; forming a gate structure on the wafer; forming trenches for a source and a drain adjacent to the gate structure; and epitaxially growing a doped silicon to partially fill the trenches to form a recessed source and drain having an inverted facet, the recessed source and drain having angled walls extending from an outer periphery of the source and drain towards a center and a bottom of the source and drain. |
地址 |
Grand Cayman KY |