发明名称 SEMICONDUCTOR STRUCTURE HAVING A SOURCE AND A DRAIN WITH REVERSE FACETS
摘要 A semiconductor structure including a semiconductor wafer. The semiconductor wafer includes a gate structure, a first trench in the semiconductor wafer adjacent to a first side of the gate structure and a second trench adjacent to a second side of the gate structure, the first and second trenches filled with a doped epitaxial silicon to form a source in the filled first trench and a drain in the filled second trench such that each of the source and drain are recessed and have an inverted facet. In a preferred exemplary embodiment, the epitaxial silicon is doped with boron.
申请公布号 US2016064523(A1) 申请公布日期 2016.03.03
申请号 US201514937029 申请日期 2015.11.10
申请人 GLOBALFOUNDRIES INC. 发明人 ADAM Thomas N.;CHENG Kangguo;KHAKIFIROOZ Ali;LI Jinghong;REZNICEK Alexander
分类号 H01L29/66;H01L29/08;H01L21/02 主分类号 H01L29/66
代理机构 代理人
主权项 1. A method of forming a semiconductor structure comprising: obtaining a semiconductor wafer; forming a gate structure on the wafer; forming trenches for a source and a drain adjacent to the gate structure; and epitaxially growing a doped silicon to partially fill the trenches to form a recessed source and drain having an inverted facet, the recessed source and drain having angled walls extending from an outer periphery of the source and drain towards a center and a bottom of the source and drain.
地址 Grand Cayman KY