| 主权项 |
1. A thin film electronic component, comprising:
a substrate; a thin film electrode layer over the substrate; an inorganic insulation layer formed on said thin film electrode layer; an organic insulation layer formed on said inorganic insulation layer; and a lead-out electrode that electrically connects to the thin film electrode layer, wherein the inorganic insulation layer has a through-hole formed therein, so as to expose a portion of the thin film electrode layer, wherein the organic insulation layer has a through-hole formed therein, so as to expose the through-hole in the inorganic insulation layer, wherein said lead-out electrode is formed in the through-hole in the inorganic insulation layer and the through-hole in the organic insulation layer, and wherein a shape of a borderline defining the through-hole at a top surface of the organic insulation layer in a plan view has chamfered corners. |
