METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

摘要

A method for manufacturing a semiconductor device, which improves the mounting reliability of the semiconductor device. A plurality of leads are sandwiched and cut between an upper mold and a lower mold. There are gaps between a post (guide rail) and a bush (rail holder) which control sliding movement of the upper mold. After the leads are sandwiched between the upper mold and the lower mold and before they are cut, the positional relation between the lower mold supporting the leads and the upper mold in contact with the lower surfaces of the leads is adjusted.

主权项

1. A method for manufacturing a semiconductor device, comprising the steps of:
(a) providing a lead frame including:
a semiconductor chip,a plurality of leads each being electrically coupled to the semiconductor chip and having an inner lead part and an outer lead part, anda sealing member sealing the inner lead parts of the leads; and (b) partially cutting the outer lead parts of the leads, exposed from the sealing member to cut the leads off the lead frame, wherein in plan view the sealing member has a first side and a second side opposite to the first side, wherein the leads include a first lead protruding from the first side of the sealing member and extending in a first direction and a second lead protruding from the second side of the sealing member and extending in the first direction, wherein the first lead and the second lead each have a lower surface including a portion which, with the semiconductor device mounted on a mounting board, faces a mounting surface of the mounting board for mounting the semiconductor device, and an upper surface opposite to the lower surface, the step (b) comprising the steps of: (b1) supporting the upper surface of the first lead and the upper surface of the second lead by a first mold; (b2) after the step (b1), making a second mold move toward and contact the lower surface of the first lead and the lower surface of the second lead; (b3) after the step (b2), aligning the second mold with the first mold; (b4) after the step (b3), cutting the first lead and the second lead simultaneously using the first mold and the second mold, wherein the first mold used in the step (b) has a first die for supporting the first lead and a second die for supporting the second lead, wherein the second mold used in the step (b) has a first punch located outside the first die in the first direction to cut the first lead and a second punch located outside the second die in the first direction to cut the second lead, and wherein in the step (b3), alignment is performed so that a first clearance distance from the first punch to the first die and a second clearance distance from the second punch to the second die are equal.