| 发明名称 |
CHIP ON FILM PACKAGE AND DISPLAY APPARATUS HAVING THE SAME |
| 摘要 |
A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate, The IC Chip is electrically connected to the input line. The output line includes a main output and a sub output line, The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction. |
| 申请公布号 |
US2016062172(A1) |
申请公布日期 |
2016.03.03 |
| 申请号 |
US201514678406 |
申请日期 |
2015.04.03 |
| 申请人 |
SAMSUNG DISPLAY CO., LTD. |
发明人 |
Lee Chong-Guk;Won Joo-Yeon;Jang Se-Hui;Moon Su-Mi;Lee Dong-Wook |
| 分类号 |
G02F1/1345;H01L23/00;H01L27/12 |
主分类号 |
G02F1/1345 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip on film package comprising:
a base substrate; an input line disposed on the base substrate; an integrated circuit (IC) chip electrically connected to the input line; and an output line, wherein the output line comprises:
a main output line electrically connected to the IC chip, wherein the main output line extends in a first direction from the IC chip; anda sub output line electrically connected to the IC chip, wherein the sub output line comprises at least six bending parts, and wherein the sub output line extends in the first direction. |
| 地址 |
Yongin-City KR |
