发明名称 LASER PROCESSING METHOD AND LASER PROCESSING PROGRAM CREATION DEVICE
摘要 A laser processing program creation device sets an evaluation region in an adjacent plane to a target plane; calculates the position of the extremity of the product profile in the axial direction within the evaluation region; sets a first line segment passing through the position of the extremity and extending orthogonally to the axis in the target plane; locates a processing area in the range surrounded by the first line segment, a second line segment, and the product profile, the second line segment extending in the axial direction from an end of the first line segment to the product profile; allocates a trajectory for laser beam cutting to form a notch or a hole in the processing area; and allocates a trajectory for laser beam cutting to cut the material along the product profile.
申请公布号 US2016059358(A1) 申请公布日期 2016.03.03
申请号 US201414784679 申请日期 2014.01.22
申请人 AMADA HOLDINGS CO., LTD. 发明人 OOTSU Takaaki
分类号 B23K26/38;B23K26/70;G05B19/4097 主分类号 B23K26/38
代理机构 代理人
主权项 1. A laser processing method using an angle or a channel as a material to be processed, the angle or channel being composed of a plurality of planes and having a predetermined plate thickness, and cutting the material with a laser beam in a direction intersecting an axis about which the material is rotated to form a product having a predetermined shape, the method comprising: for a development view representing the plurality of planes developed into a plane, setting an outer corner between the planes adjacent to each other as a development auxiliary line and setting ranges corresponding to plate thicknesses in the planes of the material as plate thickness regions between the development auxiliary line and a pair of plate thickness lines sandwiching the development auxiliary line; sequentially selecting each of the plurality of planes as a target plane and setting a region in an adjacent plane adjacent to the target plane as an evaluation region, the region in the adjacent plane including at least a range surrounded by the development auxiliary line and the plate thickness line located in the adjacent plane; calculating the position of the extremity of a profile of the product in the axial direction in the evaluation region; setting a first line segment in the target plane, the first line segment passing through the calculated position of the extremity and extending in the direction orthogonal to the axis; determining whether the first line segment interferes with the product; in one of the plurality of target planes where the first line segment does not interfere with the product, locating a processing area to form a notch or a hole in a region between the first line segment and the profile of the product; in the target plane where the processing area is located, allocating a trajectory for laser beam cutting to form a notch or a hole in the processing area and forming a notch or a hole in the material; and in the target plane where the processing area is not located, allocating a trajectory for laser beam cutting to cut the material along the profile of the product and cutting the material along the profile of the product.
地址 Kanagawa JP