发明名称 RESIN COMPOSITION
摘要 The present invention provides a resin composition containing 100 parts by weight of a resin component, 3-300 parts by weight of a thermally expandable graphite, and 2-200 parts by weight of an inorganic filler, wherein the expansion starting temperature of the thermally expandable graphite is lower than the decomposition starting temperature of the resin component.
申请公布号 WO2016031905(A1) 申请公布日期 2016.03.03
申请号 WO2015JP74195 申请日期 2015.08.27
申请人 SEKISUI CHEMICAL CO., LTD. 发明人 SHIMAMOTO, MICHIO;YANO, HIDEAKI
分类号 C08L101/00;C08K3/00;C08K3/04;C08K5/521 主分类号 C08L101/00
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