| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-temperature Pb-free Au-Sn-Ag group solder alloy excellent in workability, a stress relaxation and so on, having a melting point of 240°C to 300°C, an Au content of about 40 mass% or less so that it is at a low cost, having practically sufficient wettability and free of hot Pb.SOLUTION: An Au-Sn-Ag group solder alloy is characterized by containing 55.0 mass% to 70.0 mass% of Sn, containing 2.0 mass% to 9.0 mass% of Ag, preferably containing 58.0 to 63.0 mass, 3.0 mass% to 7.0 mass% of Ag, and the remainder being constituted of Au. Moreover, the alloy of Au-Sn-Ag group solder alloy may preferably contain one or more Al, Cu, Ge, In, Mg, Ni, Sb, Zn and P.SELECTED DRAWING: Figure 1 |
