| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board on which an electronic component can be easily mounted.SOLUTION: A printed wiring board of an embodiment includes: a resin insulation layer having grooves each for a pad; the pad formed in each groove of the resin insulation layer; external terminals formed on the resin insulation layer; an upper solder resist layer having an opening exposing all of the pads; and a lower solder resist layer having an opening exposing external terminals separately. A gap is formed between the upper face of each pad and a first face of the resin insulation layer.SELECTED DRAWING: Figure 1 |
