发明名称 |
CONDUCTIVE BOND FOILS |
摘要 |
A bond film includes a thermoplastic polyimide adhesive that contains particles which are thermally conductive and electrically conductive particles. A conductive foil layer may be placed between two layers of adhesive to form the bond foil. This bond film has a low curing temperature which reduces CTE mismatch between different substrates and therefore allows direct bonding of substrates that have high coefficient of thermal expansion mismatch. The low curing temperature also allows for reduced processing costs. The conductive bond film does not degrade at high temperatures, allowing for service temperatures up to 350°C and thermal excursions up to 450°C. |
申请公布号 |
WO2016033522(A1) |
申请公布日期 |
2016.03.03 |
申请号 |
WO2015US47531 |
申请日期 |
2015.08.28 |
申请人 |
MATERION CORPORATION |
发明人 |
KOBA, RICHARD J.;FRAIVILLIG, JAMES |
分类号 |
B32B7/12;B32B27/20;B32B27/28;C08K3/08;C09J7/02;C09J9/02;C09J179/08;H01B1/22;H05K3/32 |
主分类号 |
B32B7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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