| 摘要 |
A plating layer having uniform thickness as to a substrate having a concave part is formed. A plating method has: a first plating process (S21) of supplying a first plating solution to the substrate (2) having the concave part (12), and forming a first plating layer (13); and a second plating process of supplying a second plating solution to the substrate (2), and forming a second plating layer (14) on the first plating layer (13), after the first plating process (S21). The concentration of an additive contained in the first plating solution is different from the concentration of an additive contained in the second plating solution. The first plating process (S21) has a process of forming a film type or a grain type first plating layer on the substrate (2) by rotating the substrate (2) at a first speed, and a process of rotating the substrate (2) by repeating a second speed and a third speed. |
