WIRE BONDING USING ELEVATED BUMPS FOR SECURING BONDS

摘要

In accordance with some embodiments, the present disclosure relates to improving the integrity of interconnections between electronic components. In some embodiments, a stitch bond can be secured by a ball or bump placed over the stitch bond. This results in forming strong, uniform interconnections and reducing or eliminating weak bonds. Further, in cases when interconnections are not formed correctly, bonding material can be recovered and reused. Efficiency is improved, yields are increased, and cost savings are achieved.

主权项

1. A method of forming a wire bond connection between a first contact and a second contact using a wire bonding machine, the method comprising:
bonding a wire to the first contact; placing a first ball on the second contact; forming a stitch bond to connect the wire to the second contact, the stitch bond formed over the first ball; and forming a ball bond by placing a second ball over the stitch bond.