| 发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME |
| 摘要 |
According to an exemplary embodiment, a semiconductor package is provided. The semiconductor package includes: a chip having a plurality of joint pads; a component having a plurality of metal caps on one side and having a grinded surface on the other side, wherein the metal caps are in contact with the joint pads of the chip. |
| 申请公布号 |
US2016064309(A1) |
申请公布日期 |
2016.03.03 |
| 申请号 |
US201514723552 |
申请日期 |
2015.05.28 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company Limited |
发明人 |
Su An-Jhih;Chen Hsien-Wei |
| 分类号 |
H01L23/495;H01L21/48;H01L23/18;H01L21/56;H01L21/463 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package, comprising:
a chip having a plurality of joint pads; a plurality of pillars connected to the chip; a component having a plurality of metal caps in contact with the joint pads of the chip; and a redistribution layer connected to the chip through the pillars. |
| 地址 |
Hsinchu TW |
