| 发明名称 |
SEALING STRUCTURE FOR WORKPIECE TO SUBSTRATE BONDING IN A PROCESSING CHAMBER |
| 摘要 |
A sealing structure is between a workpiece or substrate and a carrier for plasma processing. In one example, a substrate carrier has a top surface for holding a substrate, the top surface having a perimeter and a resilient sealing ridge on the perimeter of the top surface to contact the substrate when the substrate is being carried on the carrier. |
| 申请公布号 |
US2016064267(A1) |
申请公布日期 |
2016.03.03 |
| 申请号 |
US201514602885 |
申请日期 |
2015.01.22 |
| 申请人 |
Toh Chin Hock;Koh Tuck Foong;Thirunavukarasu Sriskantharajah;Lew Jern Sern;Sundarrajan Arvind;Ramaswami Seshadri |
发明人 |
Toh Chin Hock;Koh Tuck Foong;Thirunavukarasu Sriskantharajah;Lew Jern Sern;Sundarrajan Arvind;Ramaswami Seshadri |
| 分类号 |
H01L21/687;H01J37/32;C23C16/458 |
主分类号 |
H01L21/687 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate carrier comprising:
a top surface for holding a substrate, the top surface having a perimeter; a resilient sealing ridge on the perimeter of the top surface to contact the substrate when the substrate is being carried on the carrier. |
| 地址 |
Singapore SG |
