发明名称 |
METHOD FOR MANUFACTURING A CHIP ARRANGEMENT |
摘要 |
A method for manufacturing a chip arrangement, including disposing a chip over a carrier, wherein the bottom side of the chip is electrically connected to the first carrier side via one or more contact pads on the chip bottom side, disposing a first encapsulation material over the first carrier side, wherein the first encapsulation material at least partially surrounds the chip, and disposing a second encapsulation material over a second carrier side, wherein the second encapsulation material is in direct contact with the second carrier side. |
申请公布号 |
US2016064255(A1) |
申请公布日期 |
2016.03.03 |
申请号 |
US201514935510 |
申请日期 |
2015.11.09 |
申请人 |
Infineon Technologies AG |
发明人 |
Otremba Ralf;Hoeglauer Josef;Schredl Juergen;Schloegel Xaver;Schiess Klaus;Roemer Bernd;Fuergut Edward |
分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method for manufacturing a chip arrangement, the method comprising:
disposing a chip over a carrier, the carrier comprising a first carrier side and a second carrier side, wherein the chip has a top side facing away from the first carrier side and a bottom side opposite the top side, wherein the top side comprises one or more contact pads and the bottom side comprises one or more contact pads; electrically connecting the bottom side of the chip to the first carrier side via the one or more contact pads of the bottom side; disposing a first encapsulation material over the first carrier side, wherein the first encapsulation material at least partially surrounds the chip, wherein the first encapsulation material comprises a thermoset material; and disposing a second encapsulation material over the second carrier side, wherein the second encapsulation material is in direct contact with the second carrier side, wherein the second encapsulation material comprises a thermal interface material. |
地址 |
Neubiberg DE |