| 发明名称 |
SEALING SHEET, METHOD FOR MANUFACTURING SEALING SHEET, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT PACKAGE |
| 摘要 |
Provided are a sealing sheet having excellent flexibility and capable of producing an electronic component package which is highly reliable even if an object to be sealed has a hollow structure, a method for manufacturing the sealing sheet, and a method for manufacturing the electronic component package. The present invention is a sealing sheet containing dispersed domains of an elastomer, the domains having a maximum diameter of 20 μm or less. |
| 申请公布号 |
US2016060450(A1) |
申请公布日期 |
2016.03.03 |
| 申请号 |
US201414779859 |
申请日期 |
2014.03.17 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
Toyoda Eiji;SHIMIZU Yusaku;ISHII Jun |
| 分类号 |
C08L65/02;H03H9/64 |
主分类号 |
C08L65/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A sealing sheet comprising dispersed domains of an elastomer, the domains having a maximum diameter of 20 μm or less. |
| 地址 |
Ibaraki-shi, Osaka JP |
