| 发明名称 |
POLYIMIDE FILM ARRANGEMENT, AND MANUFACTURE AND ASSEMBLY THEREOF |
| 摘要 |
A polyimide film arrangement (e.g., a polyimide film) includes a polyimide layer having a first and a second surface opposite to each other, and a base layer peelably adhered to the first surface of the polyimide layer and containing a polyimide. The polyimide layer or the base layer includes a filler having a surface energy less than about 35 dyne/cm. Moreover, the present application also describes a method of fabricating the polyimide film arrangement, and its assembly on a substrate. |
| 申请公布号 |
US2016060404(A1) |
申请公布日期 |
2016.03.03 |
| 申请号 |
US201514839654 |
申请日期 |
2015.08.28 |
| 申请人 |
Taimide Technology Incorporation |
发明人 |
Lin Chih-Wei;Lai Chun-Ting;HUANG Yen-Po |
| 分类号 |
C08J5/18;B32B37/16;B05D7/04;B29C65/00;B05D3/02;B05D3/12;B32B27/28;B32B38/10 |
主分类号 |
C08J5/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A polyimide film comprising:
a polyimide layer having a first and a second surface opposite to each other; and a base layer containing a polyimide that is peelably adhered to the first surface of the polyimide layer. |
| 地址 |
Hsinchu County TW |
