REDUCTION-TYPE ELECTROLESS GOLD PLATING SOLUTION AND ELECTROLESS GOLD PLATING METHOD USING SAID PLATING SOLUTION

摘要

The purpose of the present invention is to provide an electroless gold plating solution which does not contain harmful substances and is capable of achieving good wire bonding performance, while suppressing corrosion of a base metal. In order to achieve this purpose, an electroless plating solution that contains a water-soluble gold compound, citric acid or a citrate, ethylenediaminetetraacetic acid or an ethylenediaminetetraacetate, hexamethylenetetramine and a chain polyamine containing three or more amino groups and an alkyl group having three or more carbon atoms is employed as a reduction-type electroless gold plating solution which is used for the purpose of forming an electroless gold plating film on the surface of an object to be plated by means of electroless plating.