发明名称 Cu-Ga SPUTTERING TARGET AND PRODUCTION METHOD FOR Cu-Ga SPUTTERING TARGET
摘要 Provided is a Cu-Ga sputtering target having a composition containing, as a non-fluorine metal component thereof, 5-60 at% Ga and 0.01-5 at% K, with the remainder being Cu and unavoidable impurities. The Cu-Ga sputtering target has a Cu-Ga-K-F area containing Cu, Ga, K, and F, in an atom mapping image obtained by wavelength-dispersive X-ray spectroscopy.
申请公布号 WO2016031974(A1) 申请公布日期 2016.03.03
申请号 WO2015JP74465 申请日期 2015.08.28
申请人 MITSUBISHI MATERIALS CORPORATION;SOLAR FRONTIER K.K. 发明人 UMEMOTO KEITA;ZHANG SHOUBIN;IO KENSUKE
分类号 C23C14/34;C22C1/04;C22C9/00;C22C28/00;C22F1/00 主分类号 C23C14/34
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