发明名称 |
MULTI-LASER SYSTEM AND METHOD FOR CUTTING AND POST-CUT PROCESSING HARD DIELECTRIC MATERIALS |
摘要 |
Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser). |
申请公布号 |
WO2016033477(A1) |
申请公布日期 |
2016.03.03 |
申请号 |
WO2015US47456 |
申请日期 |
2015.08.28 |
申请人 |
IPG PHOTONICS CORPORATION |
发明人 |
SERCEL, JEFFREY P.;MENDES, MARCO;SARRAFI, ROUZBEH;SCHOENLY, JOSHUA;SONG, XIANGYANG;HANNON, MATHEW;SOKOL, MIROSLAW |
分类号 |
B23K26/36 |
主分类号 |
B23K26/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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