发明名称 ASSEMBLY, POWER-MODULE SUBSTRATE PROVIDED WITH HEAT SINK, HEAT SINK, METHOD FOR MANUFACTURING ASSEMBLY, METHOD FOR MANUFACTURING POWER-MODULE SUBSTRATE PROVIDED WITH HEAT SINK, AND METHOD FOR MANUFACTURING HEAT SINK
摘要 An assembly obtained by joining the following together: an aluminum member comprising an aluminum alloy; and a metal member comprising copper, nickel, or silver. The aluminum member comprises an aluminum alloy having a solidus temperature that is less than the eutectic temperature of aluminum and the metal element constituting the metal member. A titanium layer is formed at the join between the aluminum member and the metal member. The aluminum member and the titanium layer form a solid-phase diffusion bond, as do the titanium layer and the metal member.
申请公布号 WO2016031754(A1) 申请公布日期 2016.03.03
申请号 WO2015JP73680 申请日期 2015.08.24
申请人 MITSUBISHI MATERIALS CORPORATION 发明人 TERASAKI NOBUYUKI;NAGATOMO YOSHIYUKI
分类号 H01L23/36;H01L23/12;H01L23/14;H01L23/473 主分类号 H01L23/36
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