发明名称 |
ASSEMBLY, POWER-MODULE SUBSTRATE PROVIDED WITH HEAT SINK, HEAT SINK, METHOD FOR MANUFACTURING ASSEMBLY, METHOD FOR MANUFACTURING POWER-MODULE SUBSTRATE PROVIDED WITH HEAT SINK, AND METHOD FOR MANUFACTURING HEAT SINK |
摘要 |
An assembly obtained by joining the following together: an aluminum member comprising an aluminum alloy; and a metal member comprising copper, nickel, or silver. The aluminum member comprises an aluminum alloy having a solidus temperature that is less than the eutectic temperature of aluminum and the metal element constituting the metal member. A titanium layer is formed at the join between the aluminum member and the metal member. The aluminum member and the titanium layer form a solid-phase diffusion bond, as do the titanium layer and the metal member. |
申请公布号 |
WO2016031754(A1) |
申请公布日期 |
2016.03.03 |
申请号 |
WO2015JP73680 |
申请日期 |
2015.08.24 |
申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
TERASAKI NOBUYUKI;NAGATOMO YOSHIYUKI |
分类号 |
H01L23/36;H01L23/12;H01L23/14;H01L23/473 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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