METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE

摘要

A method for manufacturing a light emitting diode (LED) package, the method includes providing an LED chip and forming electrodes on a top surface of the LED chip; forming a first electric insulation layer on the top surface of the LED chip, the first electric insulation layer adapted to enclose the electrodes therein; etching the first electric insulation layer to define a plurality of second through holes; forming a substrate on a top surface of the first electric insulation layer, the substrate adapted to fill in the plurality of second through holes, the substrate directly contacting the electrodes; dividing the substrate into a plurality of spaced heat dissipation parts; and forming a packaging layer on a bottom surface of the substrate, the packaging layer adapted to enclose the LED chip therein.

主权项

1. A method for manufacturing a light emitting diode (LED) package, the method comprising:
providing an LED chip and forming electrodes on a top surface of the LED chip; forming a first electric insulation layer on the top surface of the LED chip, the first electric insulation layer adapted to enclose the electrodes therein; etching the first electric insulation layer to define a plurality of second through holes forming a substrate on a top surface of the first electric insulation layer, the substrate adapted to fill in the plurality of second through holes, the substrate directly contacting the electrodes; dividing the substrate into a plurality of spaced heat dissipation parts; and forming a packaging layer on a bottom surface of the substrate, the packaging layer adapted to enclose the LED chip therein; wherein the step of etching the first electric insulation layer to define a plurality of second through holes is carried out by following steps:
forming a second photoresist layer on a top surface of the first electric insulation layer;etching a part of the second photoresist layer and the first electric insulation layer to expose the electrodes, and two second through holes defined in the first electric insulation layer; andremoving the second photoresist layer.