| 发明名称 |
CHIP PACKAGES AND METHODS OF MANUFACTURE THEREOF |
| 摘要 |
A chip package may include: a first die; at least one second die disposed over the first die; and a lid disposed over lateral portions of the first die and at least partially surrounding the at least one second die, the lid having inclined sidewalls spaced apart from and facing the at least one second die. |
| 申请公布号 |
US2016064355(A1) |
申请公布日期 |
2016.03.03 |
| 申请号 |
US201414472699 |
申请日期 |
2014.08.29 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Pan Kuo Lung;Huang Ying-Jui;Chen Yu-Feng;Chen Chen-Shien |
| 分类号 |
H01L25/065;H01L23/04;H01L23/00;H01L23/31;H01L21/56;H01L25/00;H01L23/367 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip package comprising:
a first die; at least one second die disposed over the first die; and a lid disposed over lateral portions of the first die and at least partially surrounding the at least one second die, the lid having inclined sidewalls spaced apart from and facing the at least one second die. |
| 地址 |
Hsin-Chu TW |
