发明名称 METHOD OF FORMING METAL GATE ELECTRODE
摘要 An aspect of this description relates to a method that includes partially filling an opening in a dielectric material with a high-dielectric-constant material. The method also includes partially filling the opening with a first metal material over the high-dielectric-constant material. The method further includes filling the opening with a capping layer over the first metal material. The method additionally includes partially removing the first metal material and the capping layer in the opening using a wet etching process in a solution including one or more of H2O2, NH4OH, HCl, H2SO4 or diluted HF. The method also includes fully removing the remaining capping layer in the opening using a wet etching process in a solution includes one or more of NH4OH or diluted HF. The method further includes depositing a second metal material in the opening over the remaining first metal material.
申请公布号 US2016064223(A1) 申请公布日期 2016.03.03
申请号 US201514936939 申请日期 2015.11.10
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 HOU Cheng-Hao;LIM Peng-Soon;LEE Da-Yuan;YU Xiong-Fei;CHOU Chun-Yuan;HSU Fan-Yi;CHEN Jian-Hao;HSU Kuang-Yuan
分类号 H01L21/28;H01L29/66 主分类号 H01L21/28
代理机构 代理人
主权项 1. A method, comprising: partially filling an opening in a dielectric material with a high-dielectric-constant material; partially filling the opening with a first metal material over the high-dielectric-constant material; filling a remaining portion of the opening with a capping layer over the first metal material; partially removing the first metal material and the capping layer in the opening using a first wet etching process; fully removing the remaining capping layer in the opening using a second wet etching process; and depositing a second metal material in the opening over the remaining first metal material.
地址 Hsinchu TW