| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a grinding device capable of stably and properly grinding both faces of a laminated wafer, in which two wafers are adhered. <P>SOLUTION: A grinding device grinds both faces of a laminated wafer, in which a first wafer, on which an orientation flat indicating a crystal orientation is formed, and a second wafer, on which an orientation flat smaller than the first orientation flat is formed and which has a diameter almost identical to that of the first wafer are opposed and adhered. The grinding device comprises a chuck table 54 for suction-holding the laminated wafer, and grinding means for grinding the laminated wafer held by the chuck table. A holding face of the chuck table includes a first suction region 55a corresponding to a shape of the first wafer, and a second suction region 55b corresponding to a shape of a portion of the second wafer projecting from the first wafer. When an exposed face of the first wafer is ground, the first and second suction regions are actuated. When an exposed face of the second wafer is ground, the first suction region is actuated to suction-hold the first wafer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
