| 摘要 |
The invention provides a composition for a transparent bonding chip. A conductive layer is prevented from corrosion when directly bonded with the transparent bonding chip. Bonding performance to metal wiring and steps of a printing frame, transparency and solidification are excellent. The composition for the transparent bonding chip includes (A) methacrylic acid ester copolymers with structure unit shown in the chemical formula (I), (B) a cross-linking agent and (C) a tin-based catalyst. The KOH is less than 5 mg KOH/g. In the chemical formula (I), R1 denotes a hydrogen atom or methyl, R2 denotes an alkylene with 1 to 6 carbon atoms, R3 is carbamate residue of polyolefin polyol or hydrogenated polyolefin polyol. |
