| 摘要 |
The present invention provides a resin sealing apparatus and a resin sealing method, and the baseplate can be sucked on an upper die steadily without being influenced by the position of the holes on outer circle of the baseplate. The resin sealing apparatus (100) has an upper die (110) and a lower die (130) that can get close to or far from the upper die (110) relatively, and the resin is sealed by sucking the baseplate (106) onto the upper die (110) through negative pressure, wherein the upper die (110) has a suction part (120A) that sucks the baseplate (106) in between the area corresponding to the sealing area (106A) sealed by resin on the baseplate (106) and the area corresponding to the hole (106B) that is set most close to the sealing area (106A). |
