SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE
摘要
A structure and method to improve saw singulation quality and wettability of integrated circuit packages (140) assembled with lead frames (112) having half-etched recesses (134) in leads. A method of forming a semiconductor device package includes providing a lead frame strip (110) having a plurality of lead frames. Each of the lead frames includes a depression (130) that is at least partially filled with a material (400) prior to singulating the strip.
申请公布号
EP2953160(A3)
申请公布日期
2016.03.02
申请号
EP20150172276
申请日期
2013.06.21
申请人
FREESCALE SEMICONDUCTOR, INC.
发明人
DANIELS, DWIGHT L;HOOPER, STEPHEN R;MAGNUS, ALAN J;POARCH, JUSTIN E