| 摘要 |
The purpose of the present invention is to provide a photocurable and alkaline-solution-developable resin composition which, even when containing a filler incorporated in a large quantity, gives a solder resist that has satisfactory handleability and can be inhibited from cracking or peeling off during thermal shock cycles. The composition comprises a carboxylated oligomer, a polymeric binder that has a higher molecular weight than the carboxylated oligomer, a photopolymerization initiator, a photopolymerizable monomer, and a filler, wherein the content of the filler is 30-60 mass% with respect to the total amount of the nonvolatile components of the composition. A thermoplastic resin is suitable as the polymeric binder, and the thermoplastic resin preferably is in the state of having been dissolved in a solvent so that the thermoplastic-resin solution has a solid content of 10-50 wt.%. The photocurable resin composition or a dry film obtained therefrom is advantageously applicable to the formation of a cured film such as the solder resist of a printed wiring board. |
