| 摘要 |
The desmear treatment method of the present invention is a desmear treatment method for a wiring board material in which an insulating layer made of a resin containing a filler is layered on a conductive layer. The desmear treatment method includes: a hole forming step of forming a hole passing through the insulating layer in a thickness direction thereof; and a desmear treatment step of treating the wiring board material having undergone the hole forming step with radicals. The wiring board material to be subjected to the desmear treatment step includes a depletable resist layer formed on the insulating layer, and the depletable resist layer is made of a resin to be depleted in the desmear treatment step. |
