FLOWABLE DIELECTRIC FOR SELECTIVE ULTRA LOW-K PORE SEALING

摘要

Implementations of methods and an apparatus disclosed herein relate to pore sealing of porous dielectric films using fluidal dielectric material. The methods involve a step of exposing a substrate having an exposed porous dielectric film thereon to a vapor phase dielectric precursor under conditions such that a fluidal dielectric material selectively deposits in pores of the porous dielectric material. The pores can be filled with the deposited fluidal dielectric material without depositing a continuous film on any exposed metal surface.