| 摘要 |
To provide a semiconductor module that has high reliability of electric connection by a solder and is inexpensive. A joint surface of an electrode-jointing portion (36bb) that is opposed to a surface to be jointed of a gate electrodes (G) of a bare-chip FET (35) and a joint surface of a substrate-jointing portion (36bc) that is opposed to a surface to be jointed of another wiring pattern (33c) include an outgas releasing mechanism that makes outgas generated from a molten solder during solder jointing of a metal plate connector. (3Gb) be released from solders (34c and 34f) interposed between the joint surfaces and the surfaces to be jointed. |
