发明名称 潜在性硬化剤組成物及び一液硬化性エポキシ樹脂組成物
摘要 The present invention is a latent curing agent composition comprising (A) an adduct obtained by reacting (a) an amine compound having an active hydrogen group and (b) a polyglycidyl compound, and (B) a curing agent composition for epoxy resin containing phenol resin, characterized in that the phenol resin comprises 10 to 40 mass% of a dikaryon, and the number average molecular weight (Mn) is 900 to 2,000, the weight average molecular weight (Mw) is 2,500 to 5,000, and the molecular weight distribution (Mw/Mn) is 2.0 to 4.0.
申请公布号 JP5876414(B2) 申请公布日期 2016.03.02
申请号 JP20120528597 申请日期 2011.08.11
申请人 株式会社ADEKA 发明人 小川 亮;横田 謙介;正宗 葉子
分类号 C08G59/40;C08K5/315;C08L61/06;C08L63/00 主分类号 C08G59/40
代理机构 代理人
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