| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a workpiece transfer device and a workpiece machining apparatus capable of transferring a workpiece by a compact structure without soiling the workpiece. <P>SOLUTION: A movable first arm 60 comprises a wafer gripping mechanism 72 and a first suction-holding mechanism 74. A movable second arm 66 comprises a tray 76, a positioning mechanism 78, and a second suction-holding mechanism 80. A wafer W stored in a cassette C is gripped on its edge by the wafer gripping mechanism 72 so as to be pulled out from the cassette C, and is then placed on the tray 76. The wafer W placed on the tray 76 is positioned by the positioning mechanism 78, and thereafter it is suction-held by the first suction-holding mechanism 74 to be transferred to a work table 30. After being machined, the wafer W is suction-held by the second suction-holding mechanism 80 and collected from the work table 30 to be transferred to a workpiece cleaning device 56. <P>COPYRIGHT: (C)2013,JPO&INPIT |
