发明名称 半導体装置
摘要 A rear surface opposite to one plane of a die pad is formed to be exposed from one plane of a sealing resin. In addition, a concave portion disposed to be parallel with at least a first side of an outermost edge of a central structure and a second side adjacent to the first side, respectively, is formed in the one plane of the sealing resin. Here, a depth of the concave portion is equal to or greater than a height of the outermost edge of the central structure.
申请公布号 JP5876669(B2) 申请公布日期 2016.03.02
申请号 JP20110110778 申请日期 2011.05.17
申请人 ルネサスエレクトロニクス株式会社 发明人 西川 健次
分类号 H01L21/56;H01L23/28 主分类号 H01L21/56
代理机构 代理人
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