发明名称 積層セラミック電子部品及びその製造方法
摘要 A multilayer ceramic electronic component includes a ceramic body including internal electrodes and dielectric layers, and an electrode layer disposed on at least one surface of the ceramic body and electrically connected to the internal electrodes. A conductive resin layer containing metal particles and a base resin is disposed on the electrode layer. When a weight ratio of metal to carbon in a surface portion of the conductive resin layer is defined as A, and a weight ratio of metal to carbon in an internal portion of the conductive resin layer is defined as B, A is greater than B.
申请公布号 JP5876110(B2) 申请公布日期 2016.03.02
申请号 JP20140132324 申请日期 2014.06.27
申请人 サムソン エレクトロ−メカニックス カンパニーリミテッド. 发明人 チュン・ビョン・ジン;ムン・ジェ・イク;ハン・ジェ・ファン;ユ・スン・ヒ
分类号 H01G4/232;H01G4/12;H01G4/30 主分类号 H01G4/232
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