| 摘要 |
A device module is disclosed that can be manufactured without inserting a part of an external connection into a housing recess of a die. A method of manufacturing the device module is also disclosed. The device module includes a base 100, a plastic part 200 provided on the base 100, a touch sensor 300 provided on the base 100 and embedded in the plastic part 200, and an external connection 400. The external connection 400 includes an embedded portion 410 and a lead-out portion 420. The embedded portion 410 is connected to the touch sensor 300, extends along the base 100, and is embedded in the plastic part 200. The lead-out portion 420 is contiguous with the embedded portion 410 and led out of the plastic part 200. |
