System-in-package with integrated socket

摘要

There are disclosed herein various implementations of a system-in-package with integrated socket. In one such implementation, the system-in-package includes a first active die having a first plurality of electrical connectors on a top surface of the first active die, an interposer situated over the first active die, and a second active die having a second plurality of electrical connectors on a bottom surface of the second active die. The interposer is configured to selectively couple at least one of the first plurality of electrical connectors to at least one of the second plurality of electrical connectors. In addition, a socket encloses the first and second active dies and the interposer, the socket being electrically coupled to at least one of the first active die, the second active die, and the interposer.

主权项

1. A system-in-package comprising:
a first active die having a first plurality of disjoint electrical connectors on a top surface of said first active die; an interposer situated over said first active die; a second active die having a second plurality of disjoint electrical connectors on a bottom surface of said second active die; said interposer selectively couple at least one of said first plurality of disjoint electrical connectors to at least one of said second plurality of disjoint electrical connectors; an electrically conductive heat sink enclosure enclosing said first and second active dies and said interposer, said electrically conductive heat sink enclosure being electrically coupled to said first active die, said second active die, and said interposer; and an electrically conductive socket contact between, and in physical contact with, the electrically conductive heat sink enclosure and a first side wall of at least one of the first active die, the second active die, or the interposer.