Pad conditioning tool having sapphire dressing particles

摘要

A pad conditioning tool includes a sapphire substrate with a specific orientation plane, wherein the specific orientation plane is selected from a group consisting of a-plane, c-plane, r-plane, m-plane, n-plane and v-plane, the sapphire substrate further defining a mounting surface; and a plurality of sapphire dressing particles and a plurality of scrapers formed on the mounting surface of the substrate in a predetermined geometric arrangement, wherein the dressing particles are scattered between an adjacent pair of the scrapers. In case a wafer polishing pad is conditioned by the dressing particles of the pad conditioning tool, the scrapers are capable of removing abrasive waste and particles from the wafer polishing pad during a dressing operation, thereby forming new trenches and cilia structure on a polishing surface of the wafer polishing pad.

主权项

1. A pad conditioning tool comprising:
a sapphire substrate with a specific orientation plane, wherein said specific orientation plane is selected from a group consisting of a-plane, c-plane, r-plane, m-plane, n-plane and v-plane, said sapphire substrate 40 further defining a mounting surface; and a plurality of sapphire dressing particles and a plurality of scrapers formed on said mounting surface of said sapphire substrate in a predetermined geometric arrangement, wherein each of said scrapers is curved and extends in a curved line, and said dressing particles are scattered between each adjacent pair of said scrapers; wherein, in case a wafer polishing pad is conditioned by said dressing particles of the pad conditioning tool, said plurality of scrapers are capable of removing abrasive waste and particles entirely and clearly from the wafer polishing pad during a dressing operation, thereby forming new trenches and cilia structure on a polishing surface of the wafer polishing pad, which in turn, provide high efficient polishing effects to the wafer polishing pad.