Wafer carrier with temperature distribution control

摘要

Wafer carrier arranged to hold a plurality wafers and to inject a fill gas into gaps between the wafers and the wafer carrier for enhanced heat transfer and to promote uniform temperature of the wafers. The apparatus is arranged to vary the composition, flow rate, or both of the fill gas so as to counteract undesired patterns of temperature non-uniformity of the wafers. In various embodiments, the wafer carrier utilizes at least one plenum structure contained within the wafer carrier to source a plurality of weep holes for passing a fill gas into the wafer retention pockets of the wafer carrier. The plenum(s) promote the uniformity of the flow, thus providing efficient heat transfer and enhanced uniformity of wafer temperatures.

主权项

1. A wafer carrier for use in a system for growing epitaxial layers on a plurality of wafers by chemical vapor deposition, said wafer carrier comprising:
a body portion formed symmetrically about a central axis, said body portion including generally planar top and bottom surfaces that are substantially perpendicular to said central axis; a plurality of wafer retention pockets recessed relative to said top surface of said body portion, each of said wafer retention pockets including a floor portion having an upper surface generally parallel to said top surface of said body portion; a center receptacle recessed relative to said bottom surface of said body portion, said center receptacle being concentric with said central axis; a plurality of flow passages extending radially outward from and being in fluid communication with said center receptacle; a plenum chamber defined within said body portion, said plenum chamber defining a single fluid passageway in fluid communication with, and surrounding, said plurality of flow passages; a plurality of manifold passages in fluid communication with said plenum chamber, said manifold passages having an orientation that is substantially parallel with said top surface of said body portion of said wafer carrier and extending underneath said surface of said floor portion of one of said plurality of wafer retention pockets; and a plurality of weep orifices formed in said floor portion of said one of said plurality of wafer retention pockets, each of said weep orifices being in fluid communication with one of said plurality of manifold passages and passing through said upper surface of said floor portion of said wafer retention pocket.