| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device with LED devices mounted in a device mounting recess formed in a mounting member in which the mounting member is commonly used to mount LED devices with different height dimensions. <P>SOLUTION: In a semiconductor device, on a side surface of a device mounting recess 13 formed in a mounting member 11, an electrode 17 connected with an electrode 16 on an upper surface of an LED device 15 is formed to extend from an upper part to a lower part of the side surface of the device mounting recess 13. An insulating resin 18 is filled in a gap between the side surface of the device mounting recess 13 and the LED device 15 to planarize a wiring path between the electrode 16 on the upper surface of the LED device 15 and the electrode 17 on the side surface of the device mounting recess 13 with the insulating resin 18. A wiring 19 is formed in this wiring path to connect between the electrode 16 on the upper surface of the LED device 15 and the electrode 17 on the side surface of the device mounting recess 13 with the wiring 19. The wiring 19 is formed by a thick film pattern formed by any one of a droplet discharge method such as ink jet, a printing method, a plating method, and an etching method, or by pasting a conductive plate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
