Semiconductor device and manufacturing method thereof

摘要

A semiconductor device is provided which complies with restrictions on layout on a mounting substrate side. The semiconductor device includes a wiring substrate having a plurality of bonding leads at an upper surface having a rectangular shape, a semiconductor chip mounted over the upper surface of the wiring substrate, and having a plurality of electrode pads at a main surface having a rectangular shape similar to a square shape, and a plurality of metal wires for coupling the bonding leads of the wiring substrate to the electrode pads of the semiconductor chip. In a BGA, the metal wires are arranged at three sides of a main surface of the semiconductor chip, the bonding leads are provided in lines at the upper surface of the wiring substrate outside the respective opposed short sides of the main surface of the semiconductor chip, and the metal wires are coupled to the bonding leads.

主权项

1. A semiconductor device, comprising:
a wiring substrate having a first surface and a second surface opposite thereto, the first surface being formed in a rectangular shape and provided with a plurality of leads; a semiconductor chip having a quadrilateral main surface and a back surface opposite thereto, the main surface being provided with a plurality of electrode pads, the semiconductor chip being mounted over the first surface of the wiring substrate; a plurality of metal wires for electrically coupling the leads of the wiring substrate to the electrode pads of the semiconductor chip; and a plurality of terminals for external coupling provided at the second surface of the wiring substrate, wherein the metal wires are respectively arranged at three out of four sides of the main surface of the semiconductor chip, wherein the leads are provided in:
a plurality of lines at the first surface of the wiring substrate along a short side of the first surface outside the respective sides of any one of two pairs of the opposed sides of the main surface of the semiconductor chip; anda line formed along a long side of the first surface, a distance between the short side of the first surface and the plurality of lines being greater than a distance between the long side of the first surface and the line formed along the long side of the first surface, and wherein the metal wires are electrically coupled to the leads.