发明名称 Device for detaching a product substrate off a carrier substrate
摘要 Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate.
申请公布号 US9272501(B2) 申请公布日期 2016.03.01
申请号 US201113641479 申请日期 2011.03.29
申请人 EV Group GmbH 发明人 Burggraf Jürgen;Lindner Friedrich Paul
分类号 B32B38/10;H01L21/67;B32B37/00;B32B38/00 主分类号 B32B38/10
代理机构 Kusner & Jaffe 代理人 Kusner & Jaffe
主权项 1. System for stripping a product substrate off a carrier substrate connected to the product substrate by a bonding layer, said bonding layer fixing the product substrate to the carrier substrate, wherein said system comprises: a flexible film including: a contacting surface section having an adhesive layer for mounting the product substrate to the flexible film,an attachment surface section disposed at the outer periphery of the contacting surface section, anda stripping section disposed between the contacting surface section and the attachment surface section, wherein the flexible film is elastic at least in the stripping section; a film frame fixed to the flexible film at the attachment surface section, wherein surfaces of the film frame and the flexible film define a recess that serves as a solvent reservoir for receiving (i) the bonding layer and (ii) a solvent for dissolving the bonding layer; a delivery device for delivering the solvent to the solvent reservoir; a carrier substrate holder for holding the carrier substrate, said carrier substrate holder engages with the carrier substrate (i) to apply a force to the carrier substrate in a generally downward direction and (ii) to apply a force to the carrier substrate in a generally upward direction; a film frame holder that engages with the film frame to apply to the film frame (i) at least one force in a generally upward direction and (ii) at least one force in a generally downward direction; and a control unit for: (i) controlling operation of the carrier substrate holder to engage with the carrier substrate and thereby selectively control application to the carrier substrate of (i) the force in the generally downward direction and (ii) the force in the generally upward direction, wherein the forces applied to the carrier substrate are transferred to the flexible film through connection of the carrier substrate to a product substrate mounted to the flexible film, and/or(ii) controlling operation of the film frame holder to engage with the film frame and thereby selectively control application to the film frame of (i) the at least one force in the generally upward direction and (ii) the at least one force in the generally downward direction, wherein the at least one force applied to the film frame in the generally upward direction by the film frame holder is directed against the downward force applied to the carrier substrate by the carrier substrate holder to deform at least the stripping section of the flexible film, and the at least one force applied to the film frame in the generally downward direction by the film frame holder is directed against the upward force applied to the carrier substrate by the carrier substrate holder to deform at least the stripping section of the flexible film.
地址 St. Florian am Inn AT