发明名称 放熱基板
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat radiation substrate which is formed by a composite material containing thermal conductive fibers arranged in a direction along a main surface of the substrate and achieves excellent heat radiation for heat generated from elements mounted on the heat radiation substrate. <P>SOLUTION: A heat radiation substrate (10) is formed by a fiber-reinforced composite material. Multiple sheet bodies (1), in which multiple thermal conductive fibers are arranged on a plain surface so as to contact with each other in a direction perpendicular to a main surface, are laminated so as to contact with each other and buried in a curable resin (7). <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5873244(B2) 申请公布日期 2016.03.01
申请号 JP20110047140 申请日期 2011.03.04
申请人 公益財団法人鉄道総合技術研究所;共栄電資株式会社;丸八株式会社 发明人 上條 弘貴;立花 敏行;菅原 寿秀
分类号 H01L23/36;H01L23/12 主分类号 H01L23/36
代理机构 代理人
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