发明名称 Flexible printed circuit board and method for manufacturing same
摘要 A flexible printed circuit board includes a flexible printed circuit unit and an electromagnetic shielding structure. The flexible printed circuit unit includes a base layer and a first circuit layer formed on a surface of the base layer. The electromagnetic shielding structure includes a first insulating layer and a copper layer. The first insulating layer is adhered on a surface of the first circuit layer away from the base layer. At least one blind hole is defined in the electromagnetic shielding structure. The copper layer is electrically connected to the first circuit layer by a plating structure filled in the blind hole.
申请公布号 US9277640(B2) 申请公布日期 2016.03.01
申请号 US201414586986 申请日期 2014.12.31
申请人 FuKui Precison Component (Shenzhen) Co., Ltd.;Zhen Ding Technology Co., Ltd. 发明人 Ho Ming-Jaan;Hu Xian-Qin;Shen Fu-Yun;Zhuang Yi-Qiang
分类号 H05K1/02;H05K1/11;H05K3/00;H05K1/03 主分类号 H05K1/02
代理机构 Novak Druce Connolly Bove + Quigg LLP 代理人 Novak Druce Connolly Bove + Quigg LLP
主权项 1. A method for manufacturing a flexible printed circuit board, comprising: providing a flexible printed circuit unit comprising a base layer and a first circuit layer formed on a surface of the base layer; providing a flexible resin coated copper, the flexible resin coated copper comprising a first insulating layer and a copper layer adhered with the first insulating layer; adhering the flexible resin coated copper with the flexible printed circuit unit, the first insulating layer being adhered on a surface of the first circuit layer away from the base layer; defining at least one blind holes in the flexible resin coated copper, the blind hole passing through the copper layer and the first insulating layer, a portion of the first circuit layer being exposed from the blind hole; and filling a plating structure in the blind hole, the copper layer being electrically connected to the first circuit layer by the plating structure filled in the blind hole, thereby forming a flexible printed circuit board; wherein the first insulating layer, the copper layer and the plating structure forming an electromagnetic shielding structure.
地址 Shenzhen CN