Electronic system comprising stacked electronic devices provided with integrated-circuit chips

摘要

An electronic system includes a first electronic device (with a first integrated-circuit chip) and a second electronic device (with a second integrated-circuit chip). The second electronic device is stacked above the first electronic device on a same side as the first integrated-circuit chip. Electrical connection elements located around the first integrated-circuit chip electrically connected to the second electronic device to the first electronic device. A metal plate configured for heat capture and transfer extends between the first and second electronic devices. The metal plate includes through-passages aligned to permit the electrical connection elements to pass at a distance.

主权项

1. An electronic system, comprising:
a printed circuit board, a first electronic device comprising at least one first integrated-circuit chip, electronic connection elements configured to mount the first electronic device to the printed circuit board, a second electronic device comprising at least one second integrated-circuit chip, wherein the second electronic device is stacked above the first electronic device on a same side as the first integrated circuit chip and is connected to the first electronic device by electrical connection elements located around the first integrated circuit chip, wherein the first electronic device further comprises a metal plate configured for heat capture and transfer that extends between the first electronic device and the second electronic device in a position above the first chip, said metal plate having through-passages arranged for permitting the electrical connection elements to pass through the metal plate at a distance and further including an extension part of the metal plate in contact with the printed circuit board.