Integrated circuit package with embedded bridge

摘要

Embodiments of the present disclosure are directed towards an integrated circuit (IC) package having first and second dies with first and second input/output (I/O) interconnect structures, respectively. The IC package may include a bridge having first and second electrical routing features coupled to a portion of the first and second I/O interconnect structures, respectively. In embodiments, the first and second electrical routing features may be disposed on one side of the bridge; and third electrical routing features may be disposed on an opposite side. The first and second electrical routing features may be configured to route electrical signals between the first die and the second die and the third electrical routing features may be configured to route electrical signals between the one side and the opposite side. The first die, the second die, and the bridge may be embedded in electrically insulating material. Other embodiments may be described and/or claimed.

主权项

1. An integrated circuit package comprising:
a first die and a second die having a first and a second plurality of input/output (I/O) interconnect structures, respectively; and a bridge comprising
first electrical routing features electrically coupled to a portion of the first plurality of I/O interconnect structures;second electrical routing features electrically coupled to a portion of the second plurality of I/O interconnect structures, the first and second electrical routing features disposed on a first side of the bridge; andthird electrical routing features disposed on a second side of the bridge, opposite the first side, wherein the first electrical routing features and the second electrical routing features are coupled by an electrical routing of the bridge to route electrical signals between the first die and the second die, and the third electrical routing features are coupled to the electrical routing of the bridge to route electrical signals between the second side and the first side of the bridge, and wherein the first die, the second die, and the bridge are at least partially embedded in an electrically insulating layer.