| 摘要 |
PROBLEM TO BE SOLVED: To provide a chemically amplified positive photosensitive resin composition having high dry etching resistance while retaining high sensitivity.SOLUTION: A chemically amplified positive photosensitive resin composition contains (A) a polymer component described below, (B) a photoacid generator, (C) a compound represented by the general formula (1) described below, and (D) a solvent. The polymer component (A) contains a polymer satisfying at least one of (1) and (2) in the following: (1) a polymer having (a1) a constitutional unit having a residue from protection of an acid group with an acid decomposable group and (a2) a constitutional unit having a crosslinkable group; and (2) a polymer having (a1) the constitutional unit having a residue from protection of an acid group with an acid decomposable group, and a polymer having (a2) the constitutional unit having a crosslinkable group. The general formula (1) is defined as (R)-Si-(OR), where: Rrepresents a hydrocarbon group not having a reactive group; Rrepresents an alkyl group; and n is an integer in the range from 1 to 3. |
